Excellent solution for Panels of Automotive Electronics

The BMDNV04001 / BFDNV04001 series connectors deliver a high-density micro-pitch interconnect solution tailored for compact FPC-to-board and board-to-board applications.

Featuring a 0.4 mm pitch design, this series combines space-saving footprint and reliable electrical performance, ideal for display modules, imaging sensors, automotive electronics, and other embedded systems where board space is critical.

The robust contact design ensures stable connectivity, while SMT-compatible mounting supports streamlined manufacturing and consistent assembly quality.

With its fine-pitch architecture, the BMDNV04001 / BFDNV04001 series enhances signal integrity and enables efficient board layout, making it a versatile choice for modern high-density interconnect designs.

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